Presentation of sealed I/O modules
(Original Document)
Introduction
The IP67 family is constituted of sealed I/O modules that may be connected to the Fipio field bus, making it possible to create automation systems with distributed I/Os.
Its great flexibility of use makes it possible to include all available technologies on a single bus (TBX IP20 and IP65, TSX IP67, Momentum) and to use the different connection principles (branch and point to point).
Type of application
IP67 modules make it possible to have sealed I/O module interfaces in processes or machines, and in difficult environments (oil spray, pressurized water spray, dust, soldering).
The sealed structure of the modules allows them to be used when immersed up to depths of 1 m.
Software configuration
The software configuration and the addressing of the sealed I/O modules on the Fipio bus is performed using Control Expert design and setup software.
Furthermore, addressing must be carried out physically on the module.